Wingtech successfully acquired Anshi Group

It is well known in the industry that after Wingtech successfully acquired the Anshi Group, it became the largest power IDM manufacturer in A-shares in one fell swoop, but what is rarely known to the outside world is that this also includes the semiconductor equipment company ITEC. On November 7, ITEC, a semiconductor equipment company under Wingtech, made its debut at the CIIE.

Zhu Zhisong, member of the Standing Committee of the Shanghai Municipal Party Committee, Secretary of the Pudong New Area Committee, Director of the Lingang New Area Management Committee, and Director of the Yangshan Special Comprehensive Bonded Zone Management Committee, Zhu Zhisong learned more about ITEC.

Founded in 1991, ITEC has a record of providing disruptive manufacturing solutions for Philips Semiconductors, NXP (NXP), Nexperia and external parties for more than 30 years.

In 2021, ITEC becomes an independent company under Nexperia. ITEC provides the highest productivity level of assembly, testing, inspection and intelligent manufacturing platforms, supports mass manufacturing from small signal devices to power MOS devices, and is committed to providing semiconductor, RFID and MiniLED manufacturing equipment and systems.

ITEC is headquartered in Nijmegen, the Netherlands, has strong and flexible technology partners in the Eindhoven/Nijmegen high-tech equipment development zone in the Netherlands, and has a large supply chain and customer support office in Hong Kong.

Marcel Vugts, general manager of ITEC, said: ITEC is rooted in the field of semiconductor manufacturing. As a partner of Philips, NXP and Nexperia, we combine more than 30 years of automation expertise with the most advanced equipment.

Currently, ITEC provides the following benchmark solutions to achieve advanced semiconductor manufacturing:

  • ADAT assembly equipment suitable for die bonding and chip testing-the fastest assembly equipment, processing up to 20 dies per second, and each system produces 1.5 million chips per day.
  • Parset test platform-used for electrical parameter testing of small signal devices and power MOS devices, with a speed of up to 92,000 chips per hour.
  • The intelligent visual inspection system used in the front-end and back-end manufacturing of semiconductors uses deep learning technology.
  • Factory automation and intelligent manufacturing-a complete equipment control software suite that combines planning, optimization, traceability, and analysis functions, using "big data" analysis and machine learning technology to achieve industry-leading performance in high-volume semiconductor manufacturing Industry 4.0 production.

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