Huajin Semiconductor successfully completed the first round of financing of the A round

Huajin Semiconductor successfully completed the first batch of equity financing of over 200 million yuan in the A round. In December 2021, Huajin Semiconductor Packaging Leading Technology R&D Center Co., Ltd. successfully completed the first round of financing of the A round. This round of financing has attracted the participation of Shenzhen Venture Capital, Turing Fund, and the Wuxi Local Industry Investment Fund. After this financing, the company's registered capital has increased to 329 million yuan, which will help the company to promote the company's advanced packaging projects in the National Integrated Circuit Characteristic Process and Packaging and Testing Innovation Center (Huajin Phase II) and Huajin (Jiashan) in Xinwu District, Wuxi City as soon as possible. The investment and construction of (Phase I), on the one hand, improve the R&D and upgrading of advanced packaging of integrated circuits and promotes the high-density integration, performance improvement, miniaturization, and cost reduction of advanced packaging chips. Expand the share of the company's integrated circuit packaging and system integration products, and enhance the company's comprehensive competitive advantage and profitability.