Sai Microelectronics plans to build a new 8-inch wafer-level packaging and testing scale mass production line

Saiwei Electronics issued an announcement on the signing of the "Cooperation Agreement" between its holding subsidiary and Beijing Huairou Economic and Information Bureau. 

On January 29, 2022, Haichuang Microchip, a holding subsidiary of Saiwei Electronics, signed the "Cooperation Agreement" with the Economic and Information Bureau of Huairou District, Beijing (hereinafter referred to as "Huairou Economic and Information Bureau"). Based on the principle of mutual benefit, common promotion, and common development, the agreement was signed after friendly consultation. The following are the main contents of cooperation between the two parties:

1. Build a 6/8-inch MEMS wafer pilot production line and R&D platform

Build a world-leading 6/8-inch MEMS wafer pilot production line and R&D platform in the Science City Industrial Transformation Demonstration Zone to provide R&D support capabilities for the design, manufacturing, and testing of MEMS sensors, and drive the MEMS sensor industry to gather in Huairou District developing.

2. Build an 8-inch wafer-level packaging and testing scale mass production line

Build and operate an 8-inch wafer-level packaging and testing scale mass production line, build advanced MEMS packaging and testing capabilities, conduct research on advanced packaging and manufacturing technologies for MEMS devices, establish a technology innovation platform, and conduct wafer-level testing, R&D and mass production of MEMS devices. Provide advanced integrated packaging and testing services for MEMS devices such as silicon microphones, pressure, inertia, optics, RF, and biomedicine.

3. Construction and operation of Beijing Engineering Research Center

Construction and operation of advanced MEMS process design and service Beijing Engineering Research Center. Build an international technology transfer center, a MEMS process research center, a pilot-scale public service center, and a MEMS collaborative innovation service center, and carry out research and development of common key single-point process technologies, common key integration process technologies, and MEMS wafer-level manufacturing process technologies. "Three-horizontal and four-vertical" three-dimensional MEMS engineering research center.

Huairou Economic and Information Bureau is a functional organization affiliated to the People's Government of Huairou District, Beijing. The project implementation site is located in the Huairou Science City Industrial Transformation Demonstration Zone. Huairou Science City is located in the northeast of Beijing, with a planned area of ​​100.9 square kilometers, mainly in Huairou District, and expanded to parts of Miyun District. The core bearing area of ​​Beijing Huairou Comprehensive National Science Center, jointly approved by the Reform Commission and the Ministry of Science and Technology, is an important support for my country to build an innovative country and a world science and technology power.

Sai Microelectronics stated that the "Cooperation Agreement" signed this time involves investment in the construction of Huairou FAB7, MEMS Beijing Engineering Research Center, and 8-inch wafer-level packaging and testing line. The impact of the agreement on the company's operating results in 2022 and future years is expected. If this agreement can be successfully implemented and advanced, it will help to promote the development of the company's characteristic process wafer foundry and packaging and testing business.

The company is striving to transform and develop from a "boutique factory" to a "mass production factory"; in recent years, the company has planned ahead of time in combination with future market needs, and has built and expanded production capacity globally through various methods and efforts; the company's Swedish FAB1&FAB2 have mastered Silicon Pass Via (TSV), wafer bonding, deep reactive ion etching and many other process technologies and process modules with international leading competitiveness in the industry, with industry-leading through-silicon via insulating layer process platform (TSI); the company FAB3 actively Independent research and development of related process technologies such as through silicon via (TSV), wafer bonding, deep reactive ion etching, piezoelectric film deposition, wafer-level permanent bonding, high-frequency transmission micro-coaxial structure, and continuous accumulation in combination with production practice Development; Germany's FAB5 (if the acquisition is successfully approved in the future) has mature mass production capabilities for automotive CMOS chips and sensor chips, and is compatible with the integrated manufacturing process of MEMS and CMOS chips; the company's FAB6 is planning and carrying out pre-construction preparations.

The layout of the MEMS pilot test line is conducive to the company's customer reserve and product introduction for the company's MEMS mass production line and is conducive to the company's ability to better meet the needs of the MEMS process from terminal application markets such as communications, science, environment, industrial automobiles, biomedicine, and consumer electronics. development and wafer fabrication needs. Deploying advanced packaging and testing, the company's business scope will be further expanded in the MEMS industry chain, providing customers with advanced and low-cost MEMS device/system integration and wafer-level testing services, forming a one-stop "Turn-Key" The solution can meet the diversified and comprehensive needs of customers in the MEMS market, can improve the company's comprehensive competitiveness in the MEMS device manufacturing industry, broaden the company's production capacity and service capabilities, and help the company to gradually integrate and improve the industrial chain. Long-term strategic development plan.

The company's holding subsidiary Haichuang Microchip signed the "Cooperation Agreement" with Huairou Economic and Information Bureau this time, and plans to invest in the construction and operation of Huairou FAB7, MEMS Beijing Engineering Research Center, and 8-inch wafer-level packaging and testing line in Huairou District. Make full use of the superior resources of Saiwei Electronics and Huairou Science City, actively grasp the development opportunities of the semiconductor industry, and promote the development of the company's characteristic process wafer foundry business and packaging and testing business. If this cooperation can proceed smoothly in the future, it will help to further enhance the company's leading production capacity, improve the company's professional manufacturing service capabilities, meet the needs of a wide range of downstream market applications, improve the company's comprehensive competitiveness, and will have a positive impact on the company's long-term development. , in line with the company's development strategy and the interests of all shareholders.

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