At HotChips 33, Samsung revealed more details about 512GB DDR5-7200 memory modules that were unveiled in March.
These modules use eight-layer DRAM chips. Each of them contains eight crystals with a density of 16 Gb, interconnected using the technology of interlayer connections (Through-Silicon Vias, TSV). The new memory outperforms its predecessor, DDR4, in performance, data transfer rates, and capacity. At the same time, operating at a supply voltage of only 1.1 V consumes 13% less electricity.
However, Samsung estimates that the mainstream market will not move from DDR4 to DDR5 until 2023 or even 2024 at the earliest. This can be explained by the fact that the above advantages are accompanied by a higher price. Unsurprisingly, supercomputers and servers will be the first to move to DDR5. The South Korean manufacturer confirmed its intention to start shipping 512 GB DDR5-7200 server modules at the end of this year.
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