MediaTek held the EO Summit annual executive summit today. At the summit, MediaTek introduced a new generation of flagship processor-Dimensity 9000. According to reports, MediaTek Dimensity 9000 adopts TSMC's 4nm process technology and is also the world's first TSMC foundry 4nm mobile phone chip.
This afternoon, Weibo blogger @数码闲聊站 said that MediaTek will be a great leap forward next year. TSMC’s n4 flagship core is called Dimensity 9000, and the n5 flagship core may be called Dimensity 7000, which is under test.
This means that Dimensity's 7000 flagship chip will use TSMC's 5nm process technology. Previously, the Dimensity 1200 chip used 6nm process technology.
Back to Dimensity 9000 chip parameters, MediaTek Dimensity 9000 is composed of super large core, large core, and small core, including 1 Cortex X2 3.05GHz super core and 3 Cortex A710 2.85GHz large cores and 4 Cortex A510 1.8GHz The small core, GPU is ARM Mali-G710 MC10, and 6-core APU is integrated at the same time, supporting LPDDR5X 7500Mbps memory. MediaTek said that due to the addition of the new super core, its performance will be increased by 35%, and its efficiency will be increased by 37%.
In terms of imaging, MediaTek Dimensity 9000 is equipped with an 18-bit HDR-ISP image signal processor (ISP), which can support three lenses to shoot HDR video at the same time and can support up to 320 million pixel cameras.
In addition, MediaTek Dimensity 9000 supports up to WQHD+ 144Hz refresh rate screen or FHD+ 180Hz refresh rate screen, supports HDR10+, Wi-Fi 6E, and supports Bluetooth 5.3.
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