BYD plans to develop its own intelligent driving chip

Learned from a number of people familiar with the matter that BYD is planning to independently develop a dedicated chip for intelligent driving. Recruiting BSP technical team.  The report quoted sources as saying that if the progress is fast, the chip could be taped out by the end of the year. BSP is a board support package, and its function is to provide a standard interface to the operating system running on the chip. According to industry sources, it is not uncommon to start chip research and development from BSP.

In response to the above information, BYD has not yet responded.

BYD's semiconductor team has been established for nearly 20 years. It will be split and independent in 2020, and will submit a prospectus to the Shenzhen Stock Exchange for listing. At present, BYD's semiconductor products are mainly IGBT, MCU and other electronic control and industrial chips, which have not yet set foot in Intelligent driving chip and digital cockpit chip. In China, Weilai, Xiaopeng Motors, and Ideal Motors have all established large intelligent driving R&D teams. Weilai and Xiaopeng have also established chip R&D teams.

On June 8 this year, BYD Chairman Wang Chuanfu said bluntly at the shareholders' meeting, "The first half of new energy vehicles is electrification, and the second half is intelligence. The technology is open and fully verified.”

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