Chengdu Silan Semiconductor (Phase II) chip packaging plant capped

The capping ceremony of the chip packaging plant of the Chengdu Silan Semiconductor (Phase II) project was held. The second-phase plant and supporting facilities construction project of Chengdu Silan Semiconductor Manufacturing Co., Ltd. is located in Cheng'a Industrial Concentrated Development Zone, Huaikou Town, Jintang County, Chengdu. The project officially started on November 18, 2021.

In 2021, while maintaining the stable operation of the 5, 6, and 8-inch epitaxial chip production lines, Chengdu Silan has increased investment in the 12-inch epitaxial chip production line and successfully achieved output. As of the disclosure of the annual report, Chengdu Silan has formed an annual production capacity of 700,000 silicon epitaxial chips (covering 5, 6, 8, and 12-inch full-size), and its wholly-owned subsidiary, Chengdu Jijia, has also formed an annual industrial-grade production capacity. And the packaging capacity of 800,000 automotive-grade power modules (PIMs) and an annual output of 200 million MEMS sensors. As one of the core subsidiaries of Silan Microelectronics, Chengdu Silan has solid experience and capabilities in epitaxial chip production and packaging capacity.

According to the 2021 annual report of Silan Microelectronics, in 2022, it will also promote the "Phase I Construction Project of Automotive-Grade and Industrial-Grade Power Modules and Power Integrated Device Packaging Production Lines", "Chengdu Silan Phase II Plant and Supporting Facilities Construction Project", and "Chengdu Shilan Phase II". Lan 12-inch silicon epitaxial wafer expansion project” three non-raised fund projects; the investment amounts of the three projects are 755 million yuan, 160 million yuan, and 290 million yuan respectively.

In addition, on June 13, Silan Micro announced that in order to further enhance its comprehensive competitive advantage in the field of special packaging process products and meet the growing market demand, Silan intends to invest in construction through its holding subsidiary Chengdu Silan Semiconductor Manufacturing Co., Ltd. "Annual output of 7.2 million automotive-grade power module packaging project." According to the announcement, the total investment of the project is 3 billion yuan, and the funds are self-raised by the enterprise. The construction period is 3 years.

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