GPU chip and computing power provider Tianshu Zhixin has completed financing of over 1 billion yuan

China's first general-purpose GPU high-end chip and high-performance computing power system provider - Shanghai Tianshu Zhixin Semiconductor Co., Ltd. (hereinafter referred to as "Tianshu Zhixin") announced the completion of over 1 billion yuan. C + round and C + + round of financing.

The C+ round was led by Financial Street Capital, and the C++ round was led by HOPU Investments and its subsidiary Houan Innovation Fund (ie, a joint venture fund management company between HOPU Investments and ARM, a world-renowned semiconductor technology IP company). Zhongguancun Science City Science and Technology Growth Fund, Shanghai Guosheng, Xicheng Zhiyuan, Emerging Assets, Dingxiang Capital, Dingli Capital, Guangdong-Hong Kong-Macao Industry and Finance, Shanghai Free Trade Zone Equity Fund, and other well-known enterprises and institutions participated in the investment.

Tianshu Zhixin said that this round of financing will help the company to mass-produce the AI ​​inference chip Zhijia 100, develop the second and third generation AI training chips Tianga 200 and 300, expand the Tianshu Zhixin software platform, and accelerate the integration of AI and graphics.

Tianshu Zhixin successfully launched Tiangai 100, the first general-purpose GPU product for 7nm cloud training in China in December 2020, and officially released it in March 2021. By the end of March 2022, Tiangai 100 products have been realized Sales orders are nearly 200 million yuan. In May 2022, the second product, the 7nm cloud-edge reasoning chip "Intelligent Armor 100", was successfully lit up.

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