Intel will hold a groundbreaking ceremony for two fabs on campus in Licking County, near Columbus, Ohio. The President of the United States and the Governor of Ohio will be joined by the Intel CEO at the ceremony. According to reports, the new manufacturing base will be able to accommodate up to eight chip manufacturing facilities and will require an investment of about $100 billion over time.
The first two fabs at Intel's Ohio manufacturing site will reportedly cost about $20 billion and will be built concurrently, and are expected to come online in 2025. The new campus covers approximately 1,000 acres (4 square kilometers) and will be able to accommodate up to eight semiconductor fabs.
Intel did not disclose which production nodes its new fabs will use, and based on the timeline, the fabs are expected to be able to make chips using Intel's 20A and 18A manufacturing technologies.
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