Intel's newest manufacturing base broke ground

According to Intel's official news, in a webcast on Friday, September 9, local time, the US President, Ohio Governor, and Intel CEO Pat Kissinger together in Licking County, Ohio Celebrating Intel breaking ground on its newest U.S. manufacturing site in 40 years.

Intel has announced plans to invest more than $20 billion to build two new advanced chip factories in Licking County, Ohio. As part of Intel's IDM 2.0 strategy, this investment will help increase production to meet the growing demand for advanced semiconductors, power Intel's next generation of innovative products, and meet the needs of foundry customers.

The largest single private sector investment in Ohio's history, the initial phase of the project is expected to create 3,000 Intel jobs and 7,000 construction jobs throughout construction and support tens of thousands of local long-term jobs. To support the development of the new node, Intel has committed an additional $100 million for partnerships with educational institutions to build talent pipelines and support research initiatives in the region.

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