The latest report of CINNO Research shows that the market revenue of the top ten global semiconductor packaging and testing manufacturers in the first half of 2022 increased to about 17.5 billion US dollars (about 125.475 billion yuan), a year-on-year increase of about 16.7%.
The report pointed out that the top 10 shortlisted companies are consistent with the companies in the first half of 2021. Among them, there are 5 companies in Taiwan, 3 companies in mainland China, 1 company in the United States, and 1 company in Singapore.
CINNO Research said that in the future, with the continuous increase of application scenarios such as 5G communication technology, Internet of Things, big data, artificial intelligence, visual recognition, and automatic driving, the industry will have a demand for chips with smaller power loss will continue to increase, and advanced packaging, as an important means of continuing Moore's Law, has become the main increment of the global packaging and testing market in the future, and the market size will continue to grow.
- ASE Holdings (ASE)' s operating income increased by about 27.1% year-on-year, ranking first. Automotive electronics revenue from packaging and testing in the first half of 2022 increased by 54% compared to last year due to strong end-use demand due to HPC, automotive, 5G, IoT growth, and expanding silicon content.
- Amkor's operating income increased by 13.5% year-on-year, ranking second. Revenue from this segment increased 27% year-over-year due to increased demand for data centers and high-performance computing; at the same time, revenue in automotive and industrial increased 16% year-on-year. Due to the stickiness of the customer base and the binding of long-term cooperation agreements, the capacity utilization of WB and Lead Frame is still quite stable.
- JECT's operating income increased by about 8.5% year-on-year, ranking third. JCET owns industry-leading advanced semiconductor packaging and testing technologies in important fields such as 5G communications, high-performance computing, consumer, automotive and industrial. The company will further promote the production application and customer product introduction of high-density integrated SiP integration technology, and 2.5D / 3D wafer-level chiplet integration technology.
- Powertech's operating income increased by about 8.9% year-on-year, ranking fourth. Licheng Technology's revenue in the first half of the year hit a record high for the same period. Under the demand for data centers, automotive electronics, and high-end computing, the demand for DRAM production capacity remained stable. NAND & SSD will also be affected due to lower sales and inventory adjustments in the consumer electronics market, but data center demand will remain. The company will continue to maintain the development of Flip Chip and advanced packaging and testing technology in the logic chip business.
- Tongfu Microelectronics (TFME)'s operating income increased by about 33.4% year-on-year, ranking fifth. Tongfu Microelectronics packaging and testing revenue has grown significantly thanks to the simultaneous breakthrough of major bases. Chongchuan Factory, Nantong Tongfu, Hefei Tongfu, and Tongfu Chaowei have each completed the introduction and mass production of many new products and key A breakthrough for customers, and small-scale mass production of customer 5nm products is expected in the second half of the year.
- The operating income of Huatian Technology (HT-Tech) increased by about 6.9% year-on-year, ranking sixth. Huatian Technology now has the Chiplet packaging technology platform and has completed the process development of large-scale eSiFO products, which have passed chip-level and board-level reliability certification.
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