Gartner: Localization of China's Semiconductor Manufacturing Industry Continues to Improve

Cao Menglin, research director of Gartner, published the latest research results, and the localization of China's semiconductor manufacturing industry continues to improve.

Chinese companies have made significant progress in certain areas of semiconductor manufacturing materials, wafer fabrication equipment, and device manufacturing process technologies, the study said. In some semiconductor manufacturing materials such as silicon wafers, electronic special gases, and CMP materials, Chinese companies have been able to support chip manufacturing at mature process nodes. In the main semiconductor manufacturing processes such as deposition, etching, ion implantation, CMP, cleaning, etc., Chinese equipment manufacturers can support 28nm and even 14nm process node manufacturing in some process steps. Some products can support the 5nm process node in some process steps.

Chinese material and equipment suppliers can seize the opportunity for semiconductor manufacturers to expand fab capacity and increase their market share in mature process node manufacturing. In addition, in order to reduce the risk of global supply chain disruption, Chinese semiconductor manufacturers will speed up the verification process and increase the procurement of materials and equipment from domestic suppliers, which will further promote the development of the local ecosystem.

Chinese manufacturers still lack key technical capabilities in advanced photoresist, high-end lithography equipment and state-of-the-art device manufacturing processes. In addition, various export restrictions in the United States (one of the reasons for the disruption of global supply) further constrain the development of China's domestic advanced semiconductor manufacturing technology capabilities.

Gartner estimates that by 2027, in China's semiconductor manufacturing at mature process nodes above 28nm (including traditional process nodes), the number of key raw materials and key wafer fabrication equipment from domestic manufacturers will exceed 50% . The degree of localization of semiconductor manufacturing at advanced process nodes in China continues to improve, but the speed is far less than that of mature process node manufacturing, and its localization requires more efforts from domestic manufacturers.

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