ON Semiconductor launches 3 automotive power modules for SiC on-board chargers

ON Semiconductor recently announced the launch of three power modules based on silicon carbide (hereinafter referred to as "SiC"), using die-casting mold technology for on-board vehicles of all types of electric vehicles (hereinafter referred to as "xEV"). Charging and high voltage (hereafter "HV") DCDC conversion. The APM32 series is an industry first that combines SiC technology and die-cast mold packaging to improve energy efficiency and reduce xEV charging time and is designed for high-power on-board chargers (“OBC”) ranging from 11 kW to 22 kW.

All three modules exhibit low conduction and switching losses combined with best-in-class thermal resistance and high-voltage isolation to handle 800 V bus voltages. Higher energy efficiency and less heat ultimately make OBC more powerful. It enables faster charging and a longer range of xEVs, two key factors that are highly valued by consumers.

With ON Semiconductor's end-to-end SiC supply chain capabilities and proven SiC MOSFETs and diodes, APM32 modules are highly reliable and each module is serialized for full traceability. These modules operate at junction temperatures (Tj) up to 175°C, ensuring reliability even in challenging, space-constrained automotive applications.

The two modules of the APM32 series, NVXK2TR40WXT and NVXK2TR80WDT, feature an H-bridge topology with a breakdown (V (BR) DSS) voltage of 1200 V, ensuring suitability for high voltage battery packs. They are designed for OBC and HV DCDC transition sections. The third module, the NVXK2KR80WDT, uses the Vienna rectifier topology for the power factor correction (PFC) stage of the OBC. 6-pack modules and full-bridge modules will also be launched soon to complete the SiC OBC product portfolio.

All three modules are packaged in a small, robust dual-in-line package (DIP), which ensures low module impedance. Top water cooling and isolation meet the strictest automotive industry standards. Creepage distances and clearances comply with IEC 60664-1 and IEC 60950-1. Additionally, these modules are AEC-Q101 and AQG 324 qualified.

Post a Comment