Shenzhen will speed up the research and development of chips based on RISC-V and other architectures

The Shenzhen Development and Reform Commission issued the "Several Measures for Promoting the High-Quality Development of the Semiconductor and Integrated Circuit Industry in Shenzhen (Draft for Comment)" (hereinafter referred to as the "Draft for Comment") on the 8th.

The "Draft for Comments" proposes to speed up the research and development of chips based on RISC-V and other simplified instruction set architectures. For RISC-V chip design companies that invest more than 10 million yuan (including 10 million yuan) in research and development, it will be given according to no more than 20% of the research and development investment. Subsidies, up to 10 million yuan per year; Shenzhen enterprises that sell self-developed chips and the cumulative sales amount of a single model exceeds 20 million yuan will be rewarded according to no more than 15% of the sales amount of the year, up to 10 million yuan.

In addition, Shenzhen will focus on breaking through the design of high-end general-purpose chips such as CPU, GPU, DSP, and FPGA, and lay out the development of special-purpose chips such as artificial intelligence chips and edge computing chips. Accelerate the research on EDA core technologies, promote the localization of the entire process of EDA tools and software such as analog, digital, and radio frequency integrated circuits, and support the development of EDA technologies such as advanced process technology, new generation intelligence, and ultra-low power consumption. It is reported that for enterprises or scientific research institutions that purchase domestic EDA tool software, Shenzhen will give subsidies not exceeding 70% of the actual expenditure, up to 10 million yuan per year.

The full text of the draft:

Shenzhen on promoting the semiconductor and integrated circuit industry

Several measures for high-quality development

(Draft for comments)

In order to implement the strategic deployment of the CPC Central Committee and the State Council on the development of the integrated circuit industry, promote the key breakthroughs and overall improvement of the semiconductor and integrated circuit industry in our city, cultivate a sound industrial ecology, and enhance the core competitiveness of the industry, fully link the "On Accelerating the Integrated Circuit Industry". Several Measures for Development" (Shen Fu Ban Gui [2019] No. 4), combined with the "Shenzhen Action Plan for Cultivating and Developing Semiconductor and Integrated Circuit Industry Clusters (2022-2025)", in accordance with the principles of precision and operability, combined with the city's Actual situation, formulate the following measures.

Applicable institutions and key support areas

This measure applies to integrated circuit design, manufacturing, packaging and testing, equipment, and material enterprises whose registered place, statistical place, and tax place are in Shenzhen, or enterprises, institutions, or organizations that provide relevant integrated circuit industry services. Unless otherwise specified in the specific terms of this measure.

This measure focuses on supporting high-end general-purpose chips, special-purpose chips, core chips, compound semiconductor chips, and other chip designs; silicon-based integrated circuit manufacturing; compound semiconductor manufacturing such as gallium nitride and silicon carbide; high-end electronic components manufacturing; wafer-level packaging, three-dimensional Advanced packaging and testing technologies such as packaging and Chiplet; development and application of EDA tools and key IP core technologies; production of advanced equipment and key components such as lithography, etching, ion implantation, deposition, and testing equipment; and core semiconductor materials R&D and industrialization.

Comprehensively improve the core links of the industrial chain

1. Achieve breakthroughs in core chip products. Focus on breaking through the design of high-end general-purpose chips such as CPU, GPU, DSP, and FPGA, and lay out the development of special-purpose chips such as artificial intelligence chips and edge computing chips. Driven by the 5G communication industry, it will make a comprehensive breakthrough in core chips such as RF front-end chips, baseband chips, and optoelectronic chips. Focus on pan-IoT applications such as smart "terminals", and promote the rapid industrialization of ultra-low-power dedicated chips and NB-IoT chips. For enterprises to purchase IP to carry out high-end chip research and development, a subsidy of up to 20% of the actual payment for IP purchase is given, and the total annual amount for a single enterprise does not exceed 10 million yuan. Accelerate the research and development of chips based on simplified instruction set architectures such as RISC-V. For RISC-V chip design companies that invest more than 10 million yuan (including 10 million yuan) in research and development, subsidies will be given according to no more than 20% of the research and development investment, with a maximum of 10 million yuan per year Yuan. For Shenzhen enterprises that sell self-developed chips, and the cumulative sales amount of a single model exceeds 20 million yuan, they will be rewarded according to no more than 15% of the sales amount of the year, with a maximum of 10 million yuan.
2. Strengthen the support for the tape-out of design enterprises. Actively coordinate the opening of a certain capacity of integrated circuit production lines and pilot lines supported by Shenzhen to serve the needs of small and medium-sized design enterprises in Shenzhen. Support integrated circuit design enterprises to increase research and development of new products, and focus on supporting integrated circuit design enterprises in tape-out and mask production. For Shenzhen enterprises that use multi-project wafers for research and development, a maximum of 50% of the first-round mask production cost and 70% of the direct tape-out cost of the product will be given, with an annual total of no more than 5 million yuan; for the first complete full mask, A Shenzhen enterprise that taps out a film engineering product will give the product a maximum subsidy of 50% of the first-round mask production cost and 50% of the tape-out cost, with an annual total of no more than 7 million yuan.
3. Improve semiconductor manufacturing capacity. Strengthen cooperation with integrated circuit manufacturing enterprises, plan and build integrated circuit production lines of logic technology and characteristic technology, and support the construction of high-end chip capacitors, inductors, resistors, and other electronic components production lines. Support the settlement of major semiconductor and integrated circuit manufacturing projects representing new development directions, and encourage the transformation and upgrading of existing integrated circuit production lines.
4. Catch up with the level of high-end packaging and testing. Accelerate the R&D and industrialization of power devices such as MOSFET modules and high-density memory packaging technologies, focusing on breakthroughs in wafer-level, system-level, bump, flip-chip, through-silicon via, panel-level fan-out, 3D, vacuum, Chiplet Advanced packaging core technologies such as chip), as well as advanced wafer-level testing technologies such as pulse sequence testing and IC integrated probe cards, will be subsidized according to 10% of the actual investment of the project, and a single project will not exceed 10 million yuan.
5. Accelerate the maturity of compound semiconductors. Encourage enterprises in the fields of communication equipment, new energy vehicles, power systems, rail transit, and intelligent terminals to promote and try compound semiconductor products to enhance the competitiveness of systems and complete machine products. For enterprises that purchase compound semiconductor products designed or manufactured in Shenzhen with an annual amount of more than 20 million yuan (inclusive), subsidies will be given at a rate not exceeding 20% ​​of the purchase amount, up to a maximum of 5 million yuan per year. Guide enterprises to participate in the formulation of technical standards for key links, seize the commanding heights of the industry, and enhance product market dominance and voice.

Accelerate the breakthrough of basic support links

1. Accelerate the research on EDA core technologies. Promote the localization of the entire process of EDA tool software such as analog, digital, and radio frequency integrated circuits. Support the research and development of EDA technologies such as advanced technology, next-generation intelligence, and ultra-low power consumption. Increase the promotion and application of domestic EDA tools, encourage enterprises and scientific research institutions to purchase or rent domestic EDA tool software, and promote the introduction of domestic EDA tools into college curriculum teaching. Enterprises or scientific research institutions that purchase domestic EDA tool software will be subsidized according to no more than 70% of the actual expenditure, with a maximum of 10 million yuan per year. Enterprises or scientific research institutions that rent domestic EDA tools and software will be subsidized according to no more than 50% of the actual expenditure, with a maximum of 5 million yuan per year.
2. Promote the independent control of key materials . Relying on key enterprises to speed up photomasks, photoresists, polyimides, sputtering targets, high-purity chemical reagents, electronic gases, etching solutions, cleaning agents, polishing solutions, functional additives for electroplating solutions, fluorinated coolants, ceramics The R&D and production of semiconductor materials such as powders will be subsidized according to no more than 40% of the R&D costs (including material verification and testing costs), with a maximum of 10 million yuan. Support the first batch of new materials to enter the supply chain of key integrated circuit manufacturing enterprises, and give R&D units no more than 30% of the actual sales of products within a certain period of time, with a maximum reward of 20 million yuan.
3. Breakthrough in supporting core equipment and spare parts. Encourage our city's enterprises to carry out research and development of key integrated circuit equipment and components, promote the integration of high-end equipment components and systems such as testing equipment, thin film deposition equipment, etching equipment, cleaning equipment, high vacuum pumps, etc. to carry out continuous research and development and technical research, and support the first set of key Equipment and components enter the supply chain of key integrated circuit manufacturing enterprises, and the research and development unit will be rewarded not more than 30% of the actual total sales of products within a certain period of time, with a maximum reward of 20 million yuan. Vigorously introduce domestic and foreign leading enterprises in the field of equipment and parts to settle in Shenzhen, and give a one-time settlement reward of no more than 30 million yuan.
4. Increase support for key and core technology research. Further, enhance the core competitiveness of Shenzhen's integrated circuit industry, enhance the overall independent innovation capability of the industry, break the situation that major key core technologies are controlled by others, and provides funding for key technology research in key areas, priority themes, and key special projects of the city's integrated circuit industry. Guide enterprises to increase investment in research and development, and grant subsidies for research and development expenses to Shenzhen integrated circuit enterprises that meet the conditions and carry out research and development activities. Rent subsidies will be given to newly introduced integrated circuit enterprises with an investment of more than 3 million yuan.

Fourth, cohesion to enhance the kinetic energy of industrial development

1. Actively undertake national special strategic tasks. Encourage relevant units to undertake major projects in the integrated circuit field, major technical research plans, and key research and development plans carried out by the National Development and Reform Commission, the Ministry of Industry and Information Technology, the Ministry of Science and Technology, and other ministries and commissions. According to the disbursement progress of state-approved funds, no more than 1:1 matching funds will be given, and the total amount will not exceed 30% of the total project investment. For major projects proposed by key core enterprises that can solve the problem of "stuck neck" in the integrated circuit industry chain, but have not received national funds, according to the investment of self-raised funds by the enterprises, no more than 30% of the supporting funds can be supported in stages. 1:1 supporting support will be given to those who successfully apply for the National Industrial Innovation Center, National Manufacturing Innovation Center, and National Technology Innovation Center.
2. Support enterprises to become bigger and stronger. Help the rapid development of enterprises, increase market share, and continue to expand the scale of the industry. For the Shenzhen integrated circuit EDA, IP, and design enterprises whose annual operating income exceeded 100 million yuan, 300 million yuan, 500 million yuan, and 1 billion yuan for the first time, the core team of the enterprise will be given 5 million yuan, 7 million yuan, 10 million yuan, and 1200 yuan respectively. A one-time reward of 10,000 yuan. For the Shenzhen integrated circuit manufacturing, packaging and testing, key equipment and material enterprises whose annual operating income exceeded 1 billion yuan, 2 billion yuan, 5 billion yuan, and 10 billion yuan for the first time, 5 million yuan, 7 million yuan and 1000 yuan were given to the core team of the enterprise respectively. One-time incentives of RMB 10,000 and RMB 12 million.
3. Strengthen the construction of industrial support platforms. Build public service platforms such as manufacturing innovation centers, industrial innovation centers, IC design platforms, equipment and materials R&D centers, testing and certification centers in the integrated circuit field, relying on backbone enterprises and scientific research institutions, and unite upstream and downstream enterprises, universities, research institutes, etc. Build an incubation platform for small and medium-sized enterprises, and provide subsidies not exceeding 40% of the platform construction cost, up to 30 million yuan, for platforms that meet the city's industrial layout requirements and are recognized by the municipality. After the platform is completed, the annual subsidy will be no more than 15 million yuan according to the operation and service conditions.
4. Improve the industrial investment and financing environment. Explore the establishment of municipal-level integrated circuit industry investment funds, focusing on supporting the development of the integrated circuit industry. Qualified enterprises are supported to participate in project construction and operation through financing loans and financing leases, and discounts will be given at a maximum of 2.5 percentage points of the actual loan or financing part, and the maximum discount period will not exceed 5 years. Support enterprises to make full use of multi-level capital markets such as Main Board, ChiNext, Science and Technology Innovation Board, and other multi-level capital markets for listing and financing development, and grant subsidies of no more than 15 million yuan in stages according to the listing process. Support insurance institutions to participate in the development of the integrated circuit industry, and guide insurance funds to carry out equity investment.
5. Promote the rapid growth of import and export trade. Build an information exchange and supervision platform covering the whole process of customs clearance, optimize and simplify the import and export links and procedures of integrated circuit products, and establish a "white list" of pilot units such as integrated circuit enterprises and scientific research institutions in this city to facilitate the customs clearance of pilot units. Establish a guide catalog for the import of key integrated circuit commodities, and import the commodities listed in the catalog such as the production raw materials of integrated circuits, consumables, special building materials for clean rooms, supporting systems, and integrated circuit production equipment and spare parts for enterprises, and the annual cumulative import amount exceeds 50 million yuan, a subsidy of 5% of the import value, up to 5 million yuan per year. Strictly implement the national preferential tax policies for integrated circuit enterprises, and allow the import of new equipment for major integrated circuit projects to pay import value-added tax in installments.
6. Support industry organizations to play a bridge role. Establish a semiconductor and integrated circuit industry alliance that unites the upstream and downstream of the industrial chain, continuously gather and integrates global industrial resources and strengths, and enhances the overall competitiveness of Shenzhen's semiconductor and integrated circuits. Support the development of social organizations such as industry alliances and industry associations, and grant subsidies of up to 5 million yuan according to the merits of the projects. For social organizations such as recognized alliances and associations, 50% of the actual rent and property service management fees are subsidized every year, and the subsidy can be continued for 3 years, with a maximum of 1 million yuan per year. Those who have made outstanding contributions to attracting investment will be rewarded for attracting investment.

Build a high-quality talent guarantee system

1. Strengthen talent incentives and guarantees. Give full play to the role of market regulation, highlight the use-oriented, market recognition, and market evaluation, take the market value and economic contribution of talents as the main evaluation criteria, establish a market-oriented incentive mechanism linked to the market value and economic contribution of talents, and focus on supporting the introduction and retention of talents. For front-line R&D personnel, engineering and technical backbones and middle and senior management personnel, the maximum individual reward amount is not more than 5 million yuan. Provide stable support for a certain period of time to talents who are included in the list of key integrated circuit enterprises encouraged by the state to engage in basic research and core technology research and development. For the key integrated circuit units identified by the municipal industry authority, priority will be given to housing quotas for talents.
2. Implement the IC global talent retrospective plan. Accelerate the targeted introduction of global high-end talents, innovation teams, and management teams from key countries (regions). Set up overseas talent introduction service agencies and green channels for overseas talents to return to China, open up a full-process service mechanism for "selection and retention" of high-level overseas integrated circuit talents, provide full agency services, and issue "Pengcheng Talent Cards" for high-level talents. With the card, talents can directly handle children's admission, talent housing, medical care, declaration of rewards and subsidies, etc.

Industry-university linkage to cultivate professionals at all levels. Vigorously give full play to the role of enterprises in talent training, accelerate the integration of production and education, and encourage qualified colleges and universities (including technician colleges) to cooperate with integrated circuit companies to build high-skilled talent training bases. , a one-time subsidy of no more than 20% of the base construction investment, up to 20 million yuan. Strengthen the professional construction of colleges and universities (including technician colleges), expand the enrollment scale of semiconductor majors, and focus on cultivating a group of high-level and compound talents.

Build a high-level characteristic industrial park

1. Optimizing the supply of industrial space. Coordinated by the municipal industry department, the key area of ​​the semiconductor and integrated circuit industry cluster is responsible for quantifying the annual industrial land and industrial housing indicators to ensure that the city's semiconductor and integrated circuit industry will add or upgrade 200,000 square meters of industrial land or 500,000 The supply of square meters of industrial housing. Adopt the mode of "acceptance of vacancies" and "parallel approval", carry out pre-examination of land use and site selection in advance, and simultaneously examine and approve project selection plans and industrial development supervision agreements, so as to improve the efficiency of examination and approval and speed up land transfer.
2. Increase support for the construction of characteristic parks. For the identified characteristic industrial parks that are newly built or have existing industrial space renovated, green channels will be opened in the process of project establishment, registration, and approval, and "eight links" such as nearby supporting roads, water supply, sewage, drainage, telecommunication optical cables, power supply, natural gas, and land leveling will be opened. One level" infrastructure. According to actual needs, build cross-regional dual-circuit power supply backup facilities to meet the needs of integrated circuit manufacturing enterprises for high-intensity, uninterrupted power supply.
3. Strengthen supporting measures for environmental protection. For the characteristic parks to be built, the municipal and district environmental protection departments will form a special working class to provide professional guidance services on environmental protection one-on-one. Improve the construction of environmental infrastructure in the park, encourage the park to increase investment in supporting solid, liquid, and gas pollutant treatment facilities, environmental monitoring, environmental risk emergency prevention and control, environmental informatization, etc., and provide subsidies not exceeding 50% of the construction cost, Up to 20 million yuan.

Supplementary Provisions

• The Shenzhen Municipal Development and Reform Commission is responsible for the interpretation of this measure. If the relevant policies and regulations of the state, province and city are adjusted during the implementation period, this measure can be adjusted accordingly. Each responsible unit shall formulate and issue detailed implementation rules or operating procedures in a timely manner. Encourage all districts and industrial parks to independently formulate supplementary supporting measures according to the characteristics of their respective industrial planning and layout. This measure and other similar preferential measures at the urban level shall be declared by the enterprise according to the principle of choosing the higher level rather than the lower level, without duplication of funding. Those who have already enjoyed policy support according to the "one matter, one discussion" at the city and district levels, this measure does not apply. Support again.

This measure will take effect from XX, 2022 and will be valid for 5 years.