TSMC's second-generation silicon substrate GaN technology platform is expected to be completed within this year

TSMC, which has advanced process advantages, is also actively deploying third-generation semiconductors to compete with manufacturers such as UMC, World Advanced, and Power Semiconductor. The operation strategy of the top four foundry companies should not only reduce the impact of the economic cycle, but also target the following trends under the established trends of 5G radio frequency, artificial intelligence (AI), high-speed computing (HPC), and automotive electronics. A wave of industrial growth momentum.

Liu Deyin, chairman of TSMC, once mentioned that the output value of third-generation semiconductors is relatively small, and the application side is mostly in the automotive field, which is a special technology. Should still be the largest.

The legal person pointed out that TSMC cooperated with IDM factories and IC designers. The first-generation silicon substrate GaN technology platform was completed last year and further strengthened to support multiple applications. The second-generation silicon substrate GaN technology platform under development is expected this year. Done.

In addition, UMC invested in Lianying Optoelectronics to invest in third-generation semiconductors. According to analysis, UMC and TSMC have different development strategies in the third generation of semiconductors. TSMC focuses on gallium nitride and focuses on power semiconductors, while UMC focuses on power and microwave.

The worlds advanced is to cooperate with equipment materials and silicon substrate factories to develop 8-inch new substrate materials. The worlds advanced believes that although compound semiconductors account for only 1% of the overall semiconductor market value, business opportunities derived from new materials such as gallium nitride and silicon carbide can be expected.

Post a Comment