TSMC held a legal meeting and announced the financial data for the third quarter and the outlook for the fourth quarter.
The financial report shows that in the third quarter of this year, TSMC’s revenue was US$20.23 billion (about 145.049 billion yuan), with a gross profit margin of 60.4% and an operating net profit margin of 50.6%. During the reporting period, TSMC's 5nm shipments accounted for 28% of total wafer revenue; 7nm shipments accounted for 26%; 7nm and more advanced processes accounted for 54% of total wafer revenue.
TSMC expects that revenue in the fourth quarter of this year will be about 19.9 billion US dollars (about 142.683 billion yuan) to 20.7 billion US dollars (about 148.419 billion yuan), with an average conversion of 0.4%. The quarter remained high.
According to "Juheng.com", TSMC President Wei Zhejia said at the French conference that customer demand for 3nm has exceeded TSMC's supply, and it will be fully loaded next year, partly due to continued machine delivery issues. It is estimated that 3nm revenue will account for about 4-6% of next year.
Wei Zhejia said, "TSMC is working closely with equipment suppliers to prepare more capacity for the 3nm process to support strong customer demand next year, 2024 and beyond." In addition, for the progress of the 2nm process, he revealed that everything is going well at present, even better than expected, so TSMC still expects mass production in 2025.
For the 3nm family, the current information shows that the basic version of the N3 is not optimistic due to delays and cost-effective issues. The two major customers of Apple and Intel will directly consider the 3nm iterative version of the N3E process, so the Apple iPhone 15 Pro series will use the A17 chip made by TSMC N3E.
TSMC previously announced that its goal is to mass-produce its N2 process in 2025. Unlike the 3nm series, the 2nm family will use the Gate-all-around FETs (GAAFET) transistor scheme, and will also use a new Nanosheet technology.
TSMC said that compared with the 3nm process, 2nm will have a 10% to 15% performance improvement, and can also reduce power consumption by 25% to 30%. It is expected that the N2 process will be ready for risk production by the end of 2024, and by the end of 2025. Enter high-volume production, and customers can receive their first chips in 2026.
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