AMD RX 7000 (RDNA 3) Infinity Links bandwidth up to 9.2 Gbps, 10 times that of Ryzen

The AMD RX 7000 series is equipped with an RDNA 3 architecture GPU, bringing a new chiplet design, a new computing unit, and the 2nd generation AMD Infinity Cache technology. Recently, the Japanese website ASCII released more detailed information about AMD's RDNA3 architecture, revealing that its Infinity Links small chip interconnection technology can transmit up to 9.2 Gbps, and its bandwidth density is 10 times that of EPYC and Ryzen.

The new slides detail the AMD chiplet technology used in the RDNA3 architecture, with Infinity Links delivering a transfer speed of 9.2 Gbps, increasing the bandwidth density to 10 Gbps compared to the IFOP (Infinity Fabric On-Package) technology used by Ryzen and EPYC times. AMD claims a peak bandwidth of 5.3 TB/s between MCD and GCD. However, this approach means higher latency, which the RDNA 3 architecture eliminates by introducing higher clock frequencies.

RDNA 3's static timing analysis (STA) is 30% higher than RDNA 2, and the actual clock frequency is increased by 10%.

The AMD Radeon RX 7900 series will be available on December 13, when we can learn more details about the new generation of AMD graphics cards.