ISSCC 2023: Samsung to showcase 8K DDI technology

ISSCC International Solid-State Circuit Conference, known as the "Olympic" in the field of integrated circuits and semiconductors, brings together the world's top and most cutting-edge semiconductor-related breakthroughs and progress.

The 70th ISSCC Conference will be held in San Francisco, USA on February 19. More than 3,000 researchers from more than 30 countries and regions will participate in the conference, such as Samsung, SK Hynix, TSMC, MediaTek, Sony, Intel, and other companies.

KAIST professor Jaehyouk Choi, who is a member of the ISSCC committee, said the ISSCC considered the practicality and commercial viability of the proposed technology, and more than half of the participants were chip companies.

At the preliminary press conference held in South Korea last week before ISSCC, officials introduced the technologies that will be displayed at the conference.

ISSCC 2023 received a total of 629 papers, of which only 198 papers passed the screening, covering various technologies such as analog, digital converter, digital architecture and system, digital circuit, IMDD, RF, wireless, wired, memory, etc.

Among the 198 papers, 32 papers are from South Korea; 59 papers are from Mainland China, and 42 papers are from the United States. For the first time, the number of papers in mainland China surpassed that of the United States and South Korea to rank first. Officials said the quality of papers submitted by Chinese scholars was outstanding in ISSCC 2023, covering topics ranging from machine learning to processors.

Samsung as a business had eight papers accepted, the highest number of accepted papers of any business company, although it accounted for only half of the 16 papers they submitted.

A hot area of ​​ISSCC 2023 is power management IC, accounting for 12% of the selected papers. South Korea, however, does not have any relevant papers, and KAIST professor Min-Kyu Je said in a preparatory presentation that the country lags behind the global average in areas such as gallium nitride and power transmission equipment.

In this regard, several universities in Greater China account for the largest proportion of papers on power management ICs, and their research on IoT data converters is also advanced. At present, a total of 15 DC-related papers will be published on ISSCC 2023, 11 of which are from China (including Hong Kong, Macau, and Taiwan).

Digital architecture and systems: AMD and MediaTek are expected to showcase their latest 5nm and 4nm, processors.

Research on IoT systems related to high-performance processors, mobile application processors, vehicles, and energy harvesting is active, said Ewha Womans University professor Ji-Hoon Kim. It is said that there is also research on 3D stacking and direct bonding packaging technologies based on 5nm and 4nm.

Of course, each country has its areas of expertise. For example, South Korea is the strongest in the field of image sensors and display driver ICs. Of the 18 papers accepted for this category of ISSCC 2023, 9 are from Korea.

Samsung will also submit papers on a quad-pixel 50MP CMOS image sensor and display driver IC for 8K TVs and gaming monitors. At the same time, South Korea also has a great advantage in memory chip papers, and papers in this field account for 11% of the total received papers, and it is also the second largest category after power management ICs.

SK Hynix is ​​said to be planning to showcase its more than 300-layer V-NAND technology.

Other aspects: 9 papers related to SRAM CIM were also selected, most of which came from China (including Hong Kong, Macao, and Taiwan). These studies are mainly aimed at the application of artificial intelligence and machine learning.

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