OPPO next-generation Find X will be the first to be equipped with the Dimensity 9200 flagship chip

MediaTek today released a new generation of flagship chip Dimensity 9200, with the slogan Cold, full speed. OPPO officials later said, "OPPO's next-generation Find X will be the first to be equipped with the Dimensity 9200 flagship core, bringing users a new flagship experience with extreme performance and extreme energy efficiency.

OPPO's next-generation Find X flagship is expected to be the Find X 6 series. It is reported that the new OPPO Find X6 series will be equipped with three 50-megapixel lenses at the rear, of which the main camera uses a Sony IMX989 sensor with a one-inch ultra-large bottom, the photosensitive area is increased by 172%, the photosensitive capacity is increased by 76%, and the photo speed is increased. 32.5%, the startup speed is increased by 11%, and it supports chip-level 4K HDR night scene video shooting. At the same time, the machine will also be equipped with a self-developed chip Mariana MariSilicon X chip.

The MediaTek Dimensity 9200 chip uses TSMC's second-generation 4nm process processor and integrates 17 billion transistors. Equipped with 3.05GHz Cortex-X3 super core, 3 2.85GHz A715 large cores, and 4 1.8GHz A510 small cores, all super cores and large cores support pure 64-bit applications. There are also 8MB of L3 cache and 6MB of system cache, and the GPU is Immortalis-G715 MC11.

According to official tests, the Dimensity 9200 has a 12% increase in single-core performance, a 10% increase in multi-core performance, and a 10% increase in heat dissipation compared to the Dimensity 9000's GeekBench 5 CPU, and the power consumption is reduced by up to 25% under the same performance.

The Dimensity 9200 is the first to be equipped with the Immortalis-G715 flagship GPU, which supports mobile hardware ray tracing technology. The GFXBench Manhattan 3.0 test performance is 32% higher than that of the Dimensity 9000, and the power consumption is reduced by 41%. Support variable rate rendering technology (VRS), the number of frames is increased by 10%, and the power consumption is reduced by 21%.

MediaTek Dimensity 9200 also supports LPDDR5X 8533Mbps memory, the bandwidth is 13% higher than that of Dimensity 9000, it also supports 8-channel UFS 4.0 flash memory, and uses multi-loop queue technology to greatly speed up data transmission.

Dimensity 9200 integrates TSMC's 6nm wireless connection chip, and launches "5G new dual-channel" based on dual-card mode. It is the first to support the upcoming Wi-Fi 7 wireless connection as well as Bluetooth 5.3 and Bluetooth audio LE Audio, covering global satellite signals.

Dimensity 9200 is equipped with Imagiq 890 image processor, the first to support an RGBW sensor, combined with APU 690 to launch intelligent image semantic segmentation technology, support AI dual-track snapshot, AI movie mode, etc. Equipped with MediaTek MiraVision 890 mobile display technology, it supports full-scene HDR display, including AI area image quality enhancement, multi-block layered color management, and adaptive refresh rate (power consumption reduced by 35%).

Vivo has announced the world's first MediaTek Dimensity 9200 flagship processor, which is coming soon. The new phone is expected to arrive in November.

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