Zhang Zhongmou, the founder of TSMC, said in an interview on Monday that the current 5-nanometer factory in Arizona is the most advanced process in the United States, but TSMC’s most advanced process has reached 3 nanometers. He himself confirmed that TSMC will set up the most advanced 3nm fab in the United States.
TSMC’s 12-inch wafer fab invested in Arizona, USA will hold a moving ceremony on December 6. TSMC said it plans to invite guests including customers, suppliers, academics, and government representatives to join the ceremony. Celebrating the important milestone of the first batch of machinery and equipment arriving at the factory, Zhang Zhongmou, and his wife will also participate in person. In addition, the U.S. Secretary of Commerce has promised to attend the "first machine transfer" ceremony of TSMC's Arizona fab. Zhang Zhongmou said that the US Secretary of Commerce will fly from Washington to Arizona, and the flight time will take 6 hours one way, and 12 hours for the round trip, which is a whole day's journey.
TSMC pointed out that the arrival of machinery and equipment, it means that the factory building has been partially completed, and it will be ready to move into the first batch of cutting-edge equipment for semiconductor manufacturing; the 5-nanometer factory in Arizona started about 18 months ago, and the construction The progress is as expected, and mass production will start in 2024, with a monthly production capacity of 20,000 pieces.
Was asked whether TSMC's current most advanced three-nanometer process may be transferred to other countries, such as the United States? Zhang Zhongmou said "yes", Zhang Zhongmou said that there is a plan now, but it has not been fully finalized. It should be said that it is almost finalized.
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