Samsung's Advanced Packaging Technology Falls Behind TSMC, Leading to Difficulty in Obtaining AI Chip Orders

According to a report by South Korean media outlet ITHome, Samsung's advanced packaging technology is lagging behind TSMC's, which is leading to difficulty in obtaining orders for AI chips.

TSMC's ability to secure exclusive orders for AI chips from NVIDIA is mainly due to its CoWoS advanced packaging technology. CoWoS stands for "Chip on Wafer on Substrate." It is a type of 3D packaging technology that integrates multiple dies onto a single substrate. This allows for higher performance and lower power consumption than traditional packaging methods.

Samsung is also developing its own advanced packaging technology, called Fan-Out Wafer Level Package (FOWLP). However, FOWLP is not yet as mature as CoWoS, and Samsung has not yet been able to secure any major orders for AI chips using this technology.

The report suggests that Samsung's difficulty in obtaining AI chip orders could be a major setback for the company. AI chips are becoming increasingly important in a wide range of applications, from self-driving cars to artificial intelligence assistants. Without access to these markets, Samsung could lose out on significant revenue opportunities.

The report also highlights the importance of advanced packaging technology in the semiconductor industry. As transistor manufacturing processes reach their limits, packaging technology is becoming increasingly important as a way to improve performance and reduce power consumption. Companies that can develop and deploy advanced packaging technology are likely to have a competitive advantage in the years to come.

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